Intel Core i7-9700K manual
7.5 · 1
manualIntel Core i7-9700K
Document Number: 337344-003
8
th
and 9
th
Generation Intel
®
Core™
Processor Families
Datasheet, Volume 1 of 2
Supporting 8th Generation Intel
®
Core™ Processor Families, Intel
®
Pentium
®
Processors, Intel
®
Celeron
®
Processors for U/H/S Platforms, known as Coffee
Lake
Supporting 9th Generation Intel
®
Core™ Processor Families H/S Platforms,
formerly known as Coffee Lake Refresh
April 2019
Revision
003
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- 8th and 9th Generation Intel® Core™ Processor Families
- 1 Introduction
- 2 Interfaces
- 2.1 System Memory Interface
- 2.1.1 System Memory Technology Supported
- 2.1.2 System Memory Timing Support
- 2.1.3 System Memory Organization Modes
- 2.1.4 System Memory Frequency
- 2.1.5 Technology Enhancements of Intel® Fast Memory Access (Intel® FMA)
- 2.1.6 Data Scrambling
- 2.1.7 ECC H-Matrix Syndrome Codes
- 2.1.8 DDR I/O Interleaving
- 2.1.9 Data Swapping
- 2.1.10 DRAM Clock Generation
- 2.1.11 DRAM Reference Voltage Generation
- 2.1.12 Data Swizzling
- 2.2 PCI Express* Graphics Interface (PEG)
- 2.3 Direct Media Interface (DMI)
- 2.4 Processor Graphics
- 2.5 Display Interfaces
- 2.5.1 DDI Configuration
- 2.5.2 eDP* Bifurcation
- 2.5.3 Display Technologies
- 2.5.4 DisplayPort*
- 2.5.5 High-Definition Multimedia Interface (HDMI*)
- 2.5.6 Digital Video Interface (DVI)
- 2.5.7 embedded DisplayPort* (eDP*)
- 2.5.8 Integrated Audio
- 2.5.9 Multiple Display Configurations (Dual Channel DDR)
- 2.5.10 Multiple Display Configurations (Single Channel DDR)
- 2.5.11 High-bandwidth Digital Content Protection (HDCP)
- 2.5.12 Display Link Data Rate Support
- 2.5.13 Display Bit Per Pixel (BPP) Support
- 2.5.14 Display Resolution per Link Width
- 2.5.1 DDI Configuration
- 2.6 Platform Environmental Control Interface (PECI)
- 3 Technologies
- 3.1 Intel® Virtualization Technology (Intel® VT)
- 3.2 Security Technologies
- 3.2.1 Intel® Trusted Execution Technology (Intel® TXT)
- 3.2.2 Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI)
- 3.2.3 PCLMULQDQ (Perform Carry-Less Multiplication Quad Word) Instruction
- 3.2.4 Intel® Secure Key
- 3.2.5 Execute Disable Bit
- 3.2.6 Boot Guard Technology
- 3.2.7 Intel® Supervisor Mode Execution Protection (SMEP)
- 3.2.8 Intel® Supervisor Mode Access Protection (SMAP)
- 3.2.9 Intel® Memory Protection Extensions (Intel® MPX)
- 3.2.10 Intel® Software Guard Extensions (Intel® SGX)
- 3.2.11 Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d)
- 3.2.1 Intel® Trusted Execution Technology (Intel® TXT)
- 3.3 Power and Performance Technologies
- 3.3.1 Intel® Hyper-Threading Technology (Intel® HT Technology)
- 3.3.2 Intel® Turbo Boost Technology 2.0
- 3.3.3 Intel® Thermal Velocity Boost (TVB)
- 3.3.4 Intel® Advanced Vector Extensions 2 (Intel® AVX2)
- 3.3.5 Intel® 64 Architecture x2APIC
- 3.3.6 Power Aware Interrupt Routing (PAIR)
- 3.3.7 Intel® Transactional Synchronization Extensions (Intel® TSX-NI)
- 3.3.1 Intel® Hyper-Threading Technology (Intel® HT Technology)
- 3.4 Debug Technologies
- 4 Power Management
- 4.1 Advanced Configuration and Power Interface (ACPI) States Supported
- 4.2 Processor IA Core Power Management
- 4.3 Integrated Memory Controller (IMC) Power Management
- 4.4 PCI Express* Power Management
- 4.5 Direct Media Interface (DMI) Power Management
- 4.6 Processor Graphics Power Management
- 4.7 System Agent Enhanced Intel® Speedstep® Technology
- 4.8 Voltage Optimization
- 4.9 ROP (Rest Of Platform) PMIC
- 4.1 Advanced Configuration and Power Interface (ACPI) States Supported
- 5 Thermal Management
- 5.1 Processor Thermal Management
- 5.1.1 Thermal Considerations
- 5.1.2 Intel® Turbo Boost Technology 2.0 Power Monitoring
- 5.1.3 Intel® Turbo Boost Technology 2.0 Power Control
- 5.1.4 Configurable TDP (cTDP) and Low-Power Mode
- 5.1.5 Thermal Management Features
- 5.1.5.1 Adaptive Thermal Monitor
- 5.1.5.2 Digital Thermal Sensor
- 5.1.5.3 PROCHOT# Signal
- 5.1.5.4 Bi-Directional PROCHOT#
- 5.1.5.5 Voltage Regulator Protection Using PROCHOT#
- 5.1.5.6 Thermal Solution Design and PROCHOT# Behavior
- 5.1.5.7 Low-Power States and PROCHOT# Behavior
- 5.1.5.8 THERMTRIP# Signal
- 5.1.5.9 Critical Temperature Detection
- 5.1.5.10 On-Demand Mode
- 5.1.5.11 MSR Based On-Demand Mode
- 5.1.5.12 I/O Emulation-Based On-Demand Mode
- 5.1.5.1 Adaptive Thermal Monitor
- 5.1.6 Intel® Memory Thermal Management
- 5.1.1 Thermal Considerations
- 5.2 H/U-Processor Line Thermal and Power Specifications
- 5.3 S-Processor Line Thermal and Power Specifications
- 6 Signal Description
- 6.1 System Memory Interface
- 6.2 PCI Express* Graphics (PEG) Signals
- 6.3 Direct Media Interface (DMI) Signals
- 6.4 Reset and Miscellaneous Signals
- 6.5 embedded DisplayPort* (eDP*) Signals
- 6.6 Display Interface Signals
- 6.7 Processor Clocking Signals
- 6.8 Testability Signals
- 6.9 Error and Thermal Protection Signals
- 6.10 Power Sequencing Signals
- 6.11 Processor Power Rails
- 6.12 Ground, Reserved and Non-Critical to Function (NCTF) Signals
- 6.13 Processor Internal Pull-Up/Pull-Down Terminations
- 6.1 System Memory Interface
- 7 Electrical Specifications
- 7.1 Processor Power Rails
- 7.2 DC Specifications
- 7.2.1 Processor Power Rails DC Specifications
- 7.2.2 Processor Interfaces DC Specifications
- 7.2.2.1 LPDDR3 DC Specifications
- 7.2.2.2 DDR4 DC Specifications
- 7.2.2.3 PCI Express* Graphics (PEG) DC Specifications
- 7.2.2.4 Digital Display Interface (DDI) DC Specifications
- 7.2.2.5 embedded DisplayPort* (eDP*) DC Specification
- 7.2.2.6 CMOS DC Specifications
- 7.2.2.7 GTL and OD DC Specifications
- 7.2.2.8 PECI DC Characteristics
- 7.2.2.1 LPDDR3 DC Specifications
- 8 Package Mechanical Specifications
General
| Intel | |
| Core i7-9700K | |
| procesador | |
| Inglés | |
| Ficha de datos (PDF) |
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